Producing high-purity wafers via the CMP process is a critical application and the halting of harmful slurry-DIW ...
Traditional high downforce (>2.0psi, 14kPa) chemical mechanical planarisation (CMP) processes face challenges when used to polish copper with low-k films in damascene interconnect structures.
The semiconductor industry is constantly marching toward thinner films and complex geometries with smaller dimensions, as well as newer materials. The number of chemical mechanical planarization (CMP) ...
Chipmakers are relying on machine learning for electroplating and wafer cleaning at leading-edge process nodes, augmenting traditional fault detection/classification and statistical process control in ...
To allow real-time control of dielectric chemical mechanical planarization (CMP) processes to the 45 nm device node and beyond, Santa Clara, Calif.-based semiconductor manufacturing equipment leader ...
Abstract: The with-in-wafer uniformity and geometry of the CMP process varies across the life of consumables. The pre layer geometry and thickness significantly affect the post CMP process uniformity ...
Abstract: Three-dimensional (3D) chip integration is one of the most important and main trends in the advance packaging technology. This technology calls for the stacking of integrated circuits ...
The following column was provided by Drew Chambers, product manager for Rodel Inc., a Phoenix-based supplier of polishing pads for chemical mechanical planarization (CMP) applications. Chemical ...
A potential method for future cost reductions in SiC processing involves the use of plasma polishing SiC wafers before epi growth as a replacement to the traditional CMP process. The crystal growth of ...
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