The AR4HT Series CSP sockets accept any area-array device for high-temperature testing up to 200°C and incorporate a low-profile 0.45-mm contact structure (compressed) that is shorter than other ...
Scitec Instruments has introduced a new SiC photodiode array based on four 1mm 2 SiC detector chips. The SG01L4-5 sensor is used for low noise ultra low UV radiation measurements such as ...
In recent years, the area array components like BGA, QFN, CSP, and flip chips, are aplicate wider and wider in the electronics manufacturing. Such as BGA, comparing with other components, it has ...
Abstract: An alternative to the transfer molding of area array packages is the stencil printing of the encapsulant followed by a variable frequency microwave (VFM) cure process. A block of epoxy ...
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