Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...

Unveiling the Premier Simulation Conference 2026 Get ready for Converge 2026, the simulation event you won’t want ...

Artificial intelligence (AI) is no longer a research concept — it is the economic engine driving infrastructure investment worldwide. The growth of AI data centers, powered by high-performance CPUs, ...

Pulsonix has introduced a direct interface with ADAM Research's TRM software, streamlining thermal simulation for PCB designers. As electronics shrink and power up, TRM's advanced modeling helps ...

Advancements in Building Energy Modeling This year’s Building Simulation conference really dug into how we can make ...

29% of thermal engineers are having to compromise the accuracy of their simulations due to hardware limitations, according to The State of Thermal, a survey of over 170 thermal engineers conducted by ...

In this video from PASC18, Saumil Patel from Argonne describes his poster: A low-Mach simulation of flow and heat transfer in a motored internal combustion engine using the spectral element method. A ...

Dublin, July 07, 2025 (GLOBE NEWSWIRE) -- The "Global Market for Thermal Management Systems and Materials for Advanced Semiconductor Packaging 2026-2036" report has been added to ...