Las Vegas, United States, 7 January 2026 – Quectel Wireless Solutions, an end-to-end global IoT solutions provider, today announces the launch of a new-generation smart robotic computing module, the ...

LG Innotek announced on February 25 that it will launch a new electronic component for vehicles, the Automotive Application Processor Module(AP Module), targeting automotive semiconductor component ...

LG Innotek announced on the 19th that it is aggressively entering the automotive components market with its new vehicle application processor (AP) module. This means expanding its existing automotive ...

400 components, including chipsets and memory, squeezed into a single 2.5 inches x 2.5 inches module "Aiming for mass production in the second half of 2025 and facilitating efforts to build a solid ...

LG Innotek is expanding its automotive components business into the vehicle semiconductor market with the launch of an automotive application processor (AP) module. The module acts as the vehicle’s ...